Forestall Exact Equipment Co., Ltd.

New infrared BGA Desoldering Station (RF7500)

New infrared BGA Desoldering Station (RF7500)
Product Detailed

1.BGA desoldering station
2.All infrared
3.Small volume, easy to use, to take
4.Materials are all imported from Gemany

Features:

 

 

*  Two independent heating zones, multitude temperature zones control, lead free process.

 

*  Top heating zone use to infrared

 

*  The bottom zone applies to far infrared to pre-heating to prevent PCB curve.

 

*  Six-section temperature controls, simulates re-flower effect completely.

 

*  Cools PCB after heating, to prevent PCB deformation.

 

*   With sound hint function after the welding is completed.

 

 *  Portable vacumm pen takes out BGA, it's convenient and durable.

 

*  Card board with a special tooling for a wide variety of notebook motherboard(option )

 

*  COM connection, connect with computer to achieve hi-end rework function.

 

*  BGA desoldering station.

 

 

Specifications:

MODEL

RF7500

Solder Type

Normal Solder/Lead free

SMD

µBGA,BGA,CSP,QFP

Thickness

0.5~4mm

PCB Size

MAX 250mmW*200mmL

Heating/Consumption(Upper)

IR  /300W

Heating/Consumption(Bottom)

 IR/1200W

Control

Have COM ,can connect PC

Max Consumption

1.6KW

 Power

220V   OR  380V OR 110V

Dimension

30mmL X 400mmW X 300mmH

Weight

14Kg

 Packet

Carton

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Products back view

 

 

Cool pcb after heating ,to prevent PCB deformation

 

Products left view

 

Upper IR heater

 

 

Controller

 

Temperature sensor

 

Standard carton



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